Exhibition

CIME 2023 Shenzhen Thermal Conductive & Heat Dissipation Materials and Equipment Exhibition is heating up!

As 5G large-scale commercial deployment of 5G accelerates, industries such as artificial intelligence, the Internet of Things (IoT), new energy vehicles, semiconductors, and electronic devices are introducing products with high heat flux density and high power characteristics. These advancements place unprecedented demands on thermal conductive and heat dissipation materials.

Take 5G smartphones as an example: the integration and density of chips, modules, and components have increased significantly, resulting in much higher power consumption and heat generation density. Consequently, new thermal conductive and heat dissipation materials have become a key research focus worldwide.

Domestic Growth & The Need for Localization

China’s thermal management materials industry is growing rapidly. However, due to a relatively late start, the industry remains fragmented, and there is still a gap compared to international leaders. Independent development and localization of thermal management materials and technologies have become urgent national priorities.

To foster collaboration and exchange in the thermal management field, CIME 2023 – the 10th Shenzhen International Thermal Conductive & Heat Dissipation Materials and Equipment Exhibition – will be held from August 29–31, 2023, at the Shenzhen World Exhibition & Convention Center. The event is organized by Bohán Exhibition and Liyue Exhibition.

WEFILL TEC: Enabling Long-Term Reliability in Electronics

At this premier industry event, WEFILL TEC will be showcasing its latest dispensing consumables and equipment. With a focus on the long-term development of electronic devices, WEFILL TEC invites engineers, researchers, and procurement professionals to explore:

• Next-generation dispensing solutions for thermal interface materials (TIMs)

• High-precision dispensing consumables optimized for high-volume manufacturing

• Innovative approaches to thermal management for high-density electronic assemblies

Visit the WEFILL TEC booth to exchange ideas and discover how advanced dispensing technologies can enhance thermal performance, reliability, and manufacturing efficiency.

Why Attend CIME 2023?

• Explore cutting-edge thermal conductivity and heat dissipation materials

• Meet leading suppliers and equipment manufacturers

• Learn about real-world case studies for 5G, automotive electronics, and semiconductors

• Discuss critical challenges in heat management for high-power, high-density devices

Event Details:

• Event: CIME 2023 – 10th Shenzhen International Thermal Conductive & Heat Dissipation Materials and Equipment Exhibition

• Date: August 29–31, 2023

• Venue: Shenzhen World Exhibition & Convention Center

Don’t miss this opportunity to stay ahead in thermal management technology. Join industry pioneers, including WEFILL TEC, and help shape the future of reliable, high-performance electronics.